GF-DL-HT Hot Plates

Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.

Read the article "Selecting a Reflow Oven."

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  • 3/4" (19mm) thick aluminum heat plates for precise, even heating
  • Temperatures up to 315°C (600°C) for soldering with lead-free solder alloys
  • Lead and Lead-free compatible
  • CE compliant
  • RoHS compliant
Power 900 W each plate
Temperature Range, standard model 37° to 315°C (100° to 600°F)
Heating Area Two 13" x 6.5" (330mm x 163mm)