GF-B-HT Reflow Oven

Cost-effective compact batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand. It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best reflow oven for the money.

This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.

Read the article "Selecting a Reflow Oven."

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  • Low-cost reflow oven best for small batch runs and prototypes.
  • Large window allows the operator to see the board throughout the entire reflow process
  • Unique shuttle system enables higher throughput than standard batch ovens
  • All stainless steel interior construction provides for years of useful life
  • Nitrogen gas inerting option available
  • Maximum board size is 12" x 12" (305mm x 305mm)
  • Compatible with lead and lead-free soldering applications
Max board width 12" x 12" (305mm x305mm)
Max board height 1.250" (32mm)
Heating zones One (1)
Max temperature 315°C (600°F)
Heat tunnel length NA
CyclonicsTM (forced air) One (1)
Conveyor extensions Dual board shuttle
Cooling station(s) Two (2)
Venting 4" (102mm) flange with integral fan
Cooling Zone Venting N/A
Nitrogen option Yes
PC Interface No
Overall dimensions (L x W x H) 38.13" x 28.13" x 14.5" (968mm x 715mm x 368mm)