GF-120HT Reflow Oven

Three (3) zone PCB reflow oven for low-volume or batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the entire printed circuit board face up to 12" wide for enhanced process control. The GF-120HT is lead-free compatible for RoHS compliant soldering or can heat up to 400°C for lead-free reflow.

Read the article "Selecting a Reflow Oven."

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  • 100 menu profile storage
  • Lead-free solder reflow capable
  • Real time graphic temperature profiler to assist in profiling of board
  • PC interface software optionally available
  • Nitrogen gas inerting option available
  • Compatible with Lead and Lead-free reflow applications
  • DDM is a long-time reflow oven manufacturer providing customization and still selling parts for 30-year old units. Call us with any special needs.
Max board width 12" (305mm)
Max board height 1.375" (35mm)
Heating zones 3 top, 3 bottom
Max temperature 400°C (752°F)
Heat tunnel length 41" (1042mm)
CyclonicsTM (forced air) Six (6)
Conveyor extensions Option
Cooling station(s) One (1)
Venting Two 4" (102mm) flanges, 100 CFM each max.
Cooling Zone Venting N/A
Nitrogen option Yes
PC Interface Option
Overall dimensions (L x W x H) 73" x 34" x 19" (1854mm x 864mm x 483mm)