GF-120HT Reflow Oven

The GF-120HT is a compact, production-ready reflow oven engineered for manufacturers and educators who need the performance of a full-scale system in a benchtop footprint. Building on the same core design philosophy as the GF-12, the GF-120HT enhances capability with a 41-inch heating tunnel—a significant increase over the GF-12’s 26-inch tunnel—to provide longer dwell times and improved thermal stability for a wider range of SMT assemblies. The oven also supports a maximum operating temperature of 400 °C, compared to the GF-12’s 350 °C limit, making the GF-120HT well suited for demanding lead-free soldering profiles and high-temperature applications. To support proper air handling and exhaust management, the GF-120HT is equipped with two 4-inch venting flanges on the hood, doubling the venting capacity of the GF-12’s single-flange design. While the overall machine footprint differs between the two models, the underlying performance specifications and process architecture remain consistent.

Like all ovens in the GF series, the GF-120HT features DDM Novastar’s horizontal convection heating technology, which provides uniform temperature distribution across the entire PCB surface. The system includes on-board profiling capability, allowing users to capture and analyze real-time temperature data directly from the board as it moves through the oven. Optional nitrogen capability supports inert-reflow environments for sensitive or high-precision assembly requirements. Despite its expanded capability, the GF-120HT maintains low power requirements, operating at 220 VAC single- or three-phase, 50 amp, 8.7 kW, while the GF-12 runs at 220 VAC single- or three-phase, 30 amp, 5.5 kW. These combined features make the GF-120HT an ideal choice for labs, prototyping environments, and small- to medium-volume production lines that require reliable thermal performance, flexible process control, and energy-efficient operation.

Read the article "Selecting a Reflow Oven."


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  • 100 menu profile storage
  • Lead-free solder reflow capable
  • Real time graphic temperature profiler to assist in profiling of board
  • PC interface software optionally available
  • Nitrogen gas inerting option available
  • Compatible with Lead and Lead-free reflow applications
  • DDM is a long-time reflow oven manufacturer providing customization and still selling parts for 30-year old units. Call us with any special needs.
Max board width 12" (305mm)
Max board height 1.375" (35mm)
Heating zones 3 top, 3 bottom
Max temperature 400°C (752°F)
Heat tunnel length 41" (1042mm)
CyclonicsTM (forced air) Six (6)
Conveyor extensions Option
Cooling station(s) One (1)
Venting Two 4" (102mm) flanges, 100 CFM each max.
Cooling Zone Venting N/A
Nitrogen option Yes
PC Interface Option
Overall dimensions (L x W x H) 73" x 34" x 19" (1854mm x 864mm x 483mm)