>Through-Hole Systems
ESS Selective Soldering Machines
Ready to automate your through-hole process? The ESS series of selective soldering machines offers the most accessible entry point into batch selective solder, but without sacrificing performance. Available in the ESS310 and ESS500 models, this selective solder equipment is engineered for short-run, high-mix, and mixed-technology applications.
Expect exceptional throughput, positioning accuracy of ±0.1mm, and near "zero defect" solder joints that consistently outperform hand soldering. Whether you're prototyping, in product development, or scaling a manufacturing operation, the ESS selective solder systems reduce labor costs, minimize rework, and deliver the reliability your process demands.
Read the article "Selecting a Selective Soldering System."
- All-inclusive system - Flux, Preheat, Solder
- Through-hole soldering flexibility - single point, drag, mini-wave, or dip soldering
- Reproducible, "zero defect" solder joints
- On-board, touch screen interface for easy instrument set-up, programming, and parameter control
- Save machine setup time and increase productivity with off-line programming with photoscan and Gerber software
- Flexibility with wettable and specialty nozzles
| Max board size | ESS500: 500 x 500mm (19.7" x 19.7") |
| Min. Neighbor Component Clearance | 1.5 - 3mm (0.06" - 0.12") depending on nozzle size |
| Preheater | 100% IR preheat |
| Solder Capacity | Approx. 15kg (33 lbs) |
| Pressure (Nitrogen) | 2 bar (30psi) |
| Flux System | Spray |
| Solder Pot and Pump | Lead-free, Single |
| Warm up Time | Approx. 45 minutes |
| Max Temperature | 400°C (725°F) |
| Consumption (Nitrogen) | 0.8 - 1.7 CFM (23 - 49 litres/min) - dependent on nozzle and nozzle shroud |
| Air Pressure | 5.5 bar (80 psi) |