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  • >SMT Equipment▲
    • Stencil Printers
    • Pick and Place
    • Reflow Ovens
    • PCB Inspection System
    • Custom Equipment
  • >Through-Hole Systems▲
    • Wave Solder Machines
    • Selective Solder Systems
    • Solder Fountains / Rework
    • Component Counters
    • Lead Formers
  • Industries▲
    • Contract Manufacturers
    • OEMs
    • Universities
    • Aerospace/Defense/Military
    • R&D/Product Development
  • Support▲
    • Learning Center
    • Product Training
    • Technical Workshops
    • Service and Support
    • File Library
  • About us▲
    • Our Team
    • History
    • Customers
    • Made in the USA
    • News and Events
  • Contact Us
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Support

  • Learning Center
  • Product Training
  • Technical Workshops
  • Service and Support
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Glossary Table W


Wave Soldering: A manufacturing operation in which solder joints are soldered simultaneously using a wave of molten solder.
Webbing: A condition in soldering where the plastic material of the printed circuit board substrate is softened as it passes over the solder wave, picking up fine particles of solder. Generally the result of inadequate curing of the plastic material comprising the substrate.
Wetting: Physical phenomenon of liquids, usually in contact with solids, where the surface tension of the liquid is reduced so that it flows and creates a very thin layer over the substrate surface.
Wetting Agent: Chemical substance added to a liquid to reduce surface tension.
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