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  • >SMT Equipment▲
    • Stencil Printers
    • Pick and Place
    • Reflow Ovens
    • PCB Inspection System
    • Custom Equipment
  • >Through-Hole Systems▲
    • Wave Solder Machines
    • Selective Solder Systems
    • Solder Fountains / Rework
    • Component Counters
    • Lead Formers
  • Industries▲
    • Contract Manufacturers
    • OEMs
    • Universities
    • Aerospace/Defense/Military
    • R&D/Product Development
  • Support▲
    • Learning Center
    • Product Training
    • Technical Workshops
    • Service and Support
    • File Library
  • About us▲
    • Our Team
    • History
    • Customers
    • Made in the USA
    • News and Events
  • Contact Us
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Relevant Articles on PCB Assembly

Horizontal Convection Reflow Technology Defined
Prior to the development of lead free soldering alloys, Horizontal Convection™ was developed for the reflow process to obtain the optimal temperature profile. DDM Novastar’s exclusive technology creates a cyclone effect through each zone of the oven to produce the most uniform temperature profile.

Horizontal Convection Reflow Technology Defined PDF

Emerging Horizontal Convection Reflow Technologies
As the preferred technology for solder reflowing surface mount assemblies, forced air convection represents a shift from infrared and other methods for reasons solidly based on principles of physics and highlighted by the accelerated push to lead-free soldering.

Emerging Horizontal Convection Reflow Technologies PDF

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