GW-10A-HT Soldering Fountain

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
Solder Fountain with Universal X, Y, & Z Board Fixture option

  • Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height ajustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • "Blow-thru" hot air nozzle option removes solder remaining in through holes during rework process
  • High temperature (350°C), compatible with lead-free operation
  • Univeral X, Y, & Z Board Fixture Option for board sizes up to 11" x 16.5" (280 x 420mm)

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Solder type Hi-temp Lead-free
Max solder temp 662°F (350°C)
Solder capacity 50 lbs (23Kg)
Blow-thru air nozzle Yes
Compressed Air Required 60 psi (4 bar)
Overall dimensions 16" x 26" x 17" (406mm x 660mm x 432mm)
Board Size 8.5" to 18" (203mm to 457mm) L x 16" (406mm) Depth
Phone: 215-485-5663  |  Fax: 215-485-5664