GW-10A-HT Soldering Fountain

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
Solder Fountain with Universal X, Y, & Z Board Fixture option

Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
10 menu storage
Overhead locator laser light pinpoints position for centering components over the wave
Height ajustable stainless steel platform
Large selection of nozzles for all component sizes
Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
"Blow-thru" hot air nozzle option removes solder remaining in through holes during rework process
High temperature (350°C), compatible with lead-free operation
Univeral X, Y, & Z Board Fixture Option for board sizes up to 11" x 16.5" (280 x 420mm)

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Solder type	Hi-temp Lead-free
Max solder temp	662°F (350°C)
Solder capacity	50 lbs (23Kg)
Blow-thru air nozzle	Yes
Compressed Air Required	60 psi (4 bar)
Overall dimensions	16" x 26" x 17" (406mm x 660mm x 432mm)
Board Size	8.5" to 18" (203mm to 457mm) L x 16" (406mm) Depth