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  • >SMT Equipment▲
    • Stencil Printers
    • Pick and Place
    • Reflow Ovens
    • PCB Inspection System
    • Custom Equipment
  • >Through-Hole Systems▲
    • Wave Solder Machines
    • Selective Solder Systems
    • Solder Fountains / Rework
    • Component Counters
    • Lead Formers
  • Industries▲
    • Contract Manufacturers
    • OEMs
    • Universities
    • Aerospace/Defense/Military
    • R&D/Product Development
  • Support▲
    • Learning Center
    • Product Training
    • Technical Workshops
    • Service and Support
    • File Library
  • About us▲
    • Our Team
    • History
    • Customers
    • Made in the USA
    • News and Events
  • Contact Us
Home > Support

Support

  • Learning Center
  • Product Training
  • Technical Workshops
  • Service and Support
  • File Library
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Glossary Table L


Laminar Flow: A constant and directional flow of filtered air across a workbench, usually parallel to the surface of the bench.
Laminate: A composite material created by bonding several layers of same or different materials together.
Lamination: The process creating laminate using pressure and heat.
Land: Conductive area on a printed circuit board to which components are attached.
Laser Direct Imaging: A method that increases board density with laser technology.
Lead Forming: A process of cutting and forming leads on devices prior to placement on a PCB. Manual and automatic lead forming machines are available.
Lead Pitch: The center-to-center distance between leads of a package.
Leakage Current: A small amount of current that flows across a dielectric area between two adjacent conductors.
Legend: Printed letters or symbols on the PCB indicating important information like part numbers or company identification.
Local Fiducial: A mark used to locate the position of land patterns for components on a printed circuit board.
LPI: Liquid Photo-Imageable solder mask.


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