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  • >SMT Equipment▲
    • Stencil Printers
    • Pick and Place
    • Reflow Ovens
    • PCB Inspection System
    • Custom Equipment
  • >Through-Hole Systems▲
    • Wave Solder Machines
    • Selective Solder Systems
    • Solder Fountains / Rework
    • Component Counters
    • Lead Formers
  • Industries▲
    • Contract Manufacturers
    • OEMs
    • Universities
    • Aerospace/Defense/Military
    • R&D/Product Development
  • Support▲
    • Learning Center
    • Product Training
    • Technical Workshops
    • Service and Support
    • File Library
  • About us▲
    • Our Team
    • History
    • Customers
    • Made in the USA
    • News and Events
  • Contact Us
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Support

  • Learning Center
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Glossary Table F


Fabrication: Manufacture of the bare board after design and prior to assembly.
Fiducial: A specific mark incorporated into the board artwork and etched along with the circuitry of the printed circuit board. This mark is used by vision systems to orient the location on the printed circuit board.
Fine Pitch: Used when referring to surface-mount components with a lead pitch of 25 mils or less.
Finger: A card-edge connector.
Flex Circuit Assembly: A way of attaching electrical components to a flexible circuit.
Flip Chips: Structures that use solder bumpers without leads to hold interconnected circuits face down on a PCB with solder bumpers without leads.
Flux: The material used to remove oxides from metal surfaces.
Functional Test: Testing an assembled device by simulating actual use.
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