Glossary Table D
| Daughter Board: A printed circuit board assembly that plugs into another assembly or motherboard via a connector or lead terminations. |
| Design For Manufacturability (DFM): An initial process to determine the feasibility of creating electronic products to achieve the highest yields possible. |
| DFSM: Dry Film Solder Mask |
| Die Bonder: The machine placement of IC chips onto a chip-on-board substrate. |
| Die: An integrated circuit chip cut from a finished wafer. |
| Dielectric: The insulating medium between conductors. |
| Dielectric Constant: The measure of a material’s ability to store electric energy. |
| Direct Chip Attach: The process by which the silicon die is mounted and interconnected directly to the printed circuit board as opposed to using a sub-carrier, including chip-on-board (COB) and flip-chips. |
| Double-Sided Assembly: PCB assembly with components on both sides of the board. |
| Drag Soldering: Soldering process in which the assembled board is “dragged” across the molten solder bath. |
| Dual Solder Wave: Soldering process used for surface mount soldering where the first wave (multi-directional, vertical jet) applies solder on the surfaces of the contacts and the second wave (laminar and flat) disperses a finishing solder to remove bridges and icicles. |
| Dynamic RAM (DRAM): Read/write memory that must be refreshed periodically to maintain the storage information. |