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  • >SMT Equipment▲
    • Stencil Printers
    • Pick and Place
    • Reflow Ovens
    • PCB Inspection System
    • Custom Equipment
  • >Through-Hole Systems▲
    • Wave Solder Machines
    • Selective Solder Systems
    • Solder Fountains / Rework
    • Component Counters
    • Lead Formers
  • Industries▲
    • Contract Manufacturers
    • OEMs
    • Universities
    • Aerospace/Defense/Military
    • R&D/Product Development
  • Support▲
    • Learning Center
    • Product Training
    • Technical Workshops
    • Service and Support
    • File Library
  • About us▲
    • Our Team
    • History
    • Customers
    • Made in the USA
    • News and Events
  • Contact Us
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Glossary of Industry Terms

Here's a glossary of terminology used in the PCB assembly industry to give you some familiarity with the processes involved.

A - Acceptance Tests to Axial Leads

B - B-Stage Material to BUS

C - CAD to Curing

D - Daughter Board to Dynamic Ram (DRAM)

E - Edge Clearance to ESR

F - Fabrication to Functional Test

G - Gerber File to Ground Plane

H - HDI to Hole Density

I - Icicling to ISO

J - JEDEC to Junction

L - Laminar Flow to LPI

M - Magazine to Multilayer PCB

N - NC Drill to NPTH

O - Organic Solder Preservative (OSP) to Outgassing

P - Package to PTH (plated through-hole)

Q - Quadpack to Quench

R - Read Access Memory (RAM)

S - Scanning Electron Microscopy to Surface Mount Technology

T - Tape Automated Bonding to Turnkey

U - Ultra-Fine Pitch (UFP) to UV Curing

V - Vapor Phase Soldering to Voids

W - Wave Soldering to Wetting Agent

X - X-Ray Laminography

Y - Yield Loss

Z - Z

ref: Phil Zarrow & Debra Kopp, Surface Mount Technology Terms and Conditions, 1997

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