« Reflow Ovens - Low Volume
GF-C2-HT Reflow Ovens
This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consistent process control. 
- Can be used as a batch oven or a hot plate system
- Programmable digital timer
- Nitrogen gas inerting option available
- Large heating area of 12" x 12" (305mm x 305mm)
- Compatible with both Lead and Lead-free applications
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| Max board width: | 12” x 12” (305mm x305mm) |
| Max board height: | 3” (76mm) |
| Heating zones: | One (1) |
| Max temperature: | 315°C (600°F) |
| Heat tunnel length: | NA |
| CyclonicsTM (forced air): | One (1) |
| Conveyor extensions: | NA |
| Cooling station(s) : | NA |
| Venting: | NA |
| Cooling Zone Venting: | N/A |
| Nitrogen option: | Yes |
| PC Interface: | No |
| Overall dimensions (L x W x H): | 29.12” x 16.5” x 12”H (740mm x 420mm x 305mm) |