Relevant Articles on PCB Assembly
How To Profile A PCB
Getting the correct temperature profile is more important than ever, especially with the new lead free solders. This paper describes the parameters and methods for profiling reflow solder temperatures to maintain optimal performance.
How To Profile A PCB PDF
Horizontal Convection Reflow Technology Defined
Prior to the development of lead free soldering alloys, Horizontal Convection™ was developed for the reflow process to obtain the optimal temperature profile. DDM Novastar’s exclusive technology creates a cyclone effect through each zone of the oven to produce the most uniform temperature profile.
Horizontal Convection Reflow Technology Defined PDF
Emerging Horizontal Convection Reflow Technologies
As the preferred technology for solder reflowing surface mount assemblies, forced air convection represents a shift from infrared and other methods for reasons solidly based on principles of physics and highlighted by the accelerated push to lead-free soldering.
Emerging Horizontal Convection Reflow Technologies PDF