Glossary Table U
| Ultra-Fine Pitch (UFP): Center-to-center lead distance of surface mount packages that are 0.010 inch or less. |
| Underfill: Encapsulant material that is deposited under a device to help compensate a mismatch in thermal coefficient of expansion between the device and the substrate. |
| UL: Underwriter’s Laboratories: A popular safety standard for electrical devices supported by many underwriters. |
| UV Curing: Polymerizing, hardening, or cross-linking using ultraviolet light as an energy source. |